Animation Boards

EWME provides surface mount capability down to 0201 sized components. Our equipment is capable of placing multiple kinds of IC packages including QFN and BGA.

Opal2
[Click Pictures for more info]

We currently run all surface mount products through a Heller 1707 EXL convection Oven. This oven provides several profiles for Leaded and Lead-free assemblies as well as the ability to create unique profiles for those boards that do not fit these standard profiles. 

EWME provides bench top soldering of Thru-Hole components. For larger jobs we utilize two solder fountains. One fountain is dedicated to Lead-free assemblies and the other to Leaded assemblies. These allow us to maximize the use of our technicians to complete jobs requiring multiple thru-hole components.

Phone: (512) 258-2303  Fax: (512) 258-4392 Email: info@ewme.com

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